ECE265
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ECE 265 - ELECTRONIC AND PHOTONIC INTEGRATION AND PACKAGING
Full Course Title
ELECTRONIC AND PHOTONIC INTEGRATION AND PACKAGING
Instructor Name(s)
SCHOW
Course Description
Focus on the integration of electronics and photonics to realize functional subsystems. High-speed link design and performance verification, characterization of high-speed signals, data encoding, equalization techniques, equivalent circuit models for photonic devices and packages, co-simulation of circuits and photonic devices.
Unit Value
4
Maximum number of times course can be repeated for additional credit
0
Maximum Units
4
Recommended Preparation
Knowledge of photonic (ECE 227A.B) and electronic (ECE 221A) devices and basics of fiber optic links (ECE 228A,B) preferable, but not required.